IBM's subsidiary, Anderon, has secured a $1 billion agreement with the U.S. Department of Commerce as part of the CHIPS program. The funds will be allocated to enhance the production of quantum wafers at its facility in Albany, New York.
The company and the government agency announced the deal in May 2026, signing a letter of intent at that time. IBM also revealed the establishment of Anderon as the first U.S. facility dedicated to producing 300-mm quantum wafers for various developers, instead of serving just a single client.
According to IBM, the facility will leverage the parent company's technologies, specialized equipment, and expertise. The production focuses on wafers for superconducting qubit arrays, quantum input-output components, and readout circuits.
Anderon claims that its initial products are already moving through the production line, with plans to expand its offerings to accommodate other quantum modalities.
As part of the agreement, IBM has committed to providing Anderon with $1 billion from its own resources.
This initiative is part of IBM's strategy to grow its quantum business. In June, IBM announced plans to invest over $10 billion in quantum computing over the next five years, covering research, manufacturing, partnerships, and ecosystem development.
In July, IBM CEO Arvind Krishna indicated that investments in quantum technologies would begin to significantly impact the company's revenue and profits by 2028-2029.